 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| M Features * Supports 1 Mb/s operation * Implements ISO-11898 standard physical layer requirements * Suitable for 12V and 24V systems * Externally-controlled slope for reduced RFI emissions * Detection of ground fault (permanent dominant) on TXD input * Power-on reset and voltage brown-out protection * An unpowered node or brown-out event will not disturb the CAN bus * Low current standby operation * Protection against damage due to short-circuit conditions (positive or negative battery voltage) * Protection against high-voltage transients * Automatic thermal shutdown protection * Up to 112 nodes can be connected * High noise immunity due to differential bus implementation * Temperature ranges: - Industrial (I): -40C to +85C - Extended (E): -40C to +125C PDIP/SOIC MCP2551 Package Types High-Speed CAN Transceiver TXD VSS VDD RXD 1 8 RS CANH CANL VREF 3 4 MCP2551 VDD VSS 2 7 6 5 Block Diagram VDD TXD Slope Control TXD Dominant Detect Thermal Shutdown Driver Control Power-On Reset CANH 0.5 VDD GND Reference Voltage Receiver CANL RS RXD VREF 2002 Microchip Technology Inc. Preliminary DS21667C-page 1 MCP2551 NOTES: DS21667C-page 2 Preliminary 2002 Microchip Technology Inc. MCP2551 1.0 DEVICE OVERVIEW 1.4 Operating Modes The MCP2551 is a high-speed CAN, fault-tolerant device that serves as the interface between a CAN protocol controller and the physical bus. The MCP2551 provides differential transmit and receive capability for the CAN protocol controller and is fully compatible with the ISO-11898 standard, including 24V requirements. It will operate at speeds of up to 1 Mb/s. Typically, each node in a CAN system must have a device to convert the digital signals generated by a CAN controller to signals suitable for transmission over the bus cabling (differential output). It also provides a buffer between the CAN controller and the high-voltage spikes that can be generated on the CAN bus by outside sources (EMI, ESD, electrical transients, etc.). The RS pin allows three modes of operation to be selected: * High-Speed * Slope-Control * Standby These modes are summarized in Table 1-1. When in High-Speed or Slope-Control mode, the drivers for the CANH and CANL signals are internally regulated to provide controlled symmetry in order to minimize EMI emissions. Additionally, the slope of the signal transitions on CANH and CANL can be controlled with a resistor connected from pin 8 (RS) to ground, with the slope proportional to the current output at RS, further reducing EMI emissions. 1.1 Transmitter Function The CAN bus has two states: Dominant and Recessive. A dominant state occurs when the differential voltage between CANH and CANL is greater than a defined voltage (e.g.,1.2V). A recessive state occurs when the differential voltage is less than a defined voltage (typically 0V). The dominant and recessive states correspond to the low and high state of the TXD input pin, respectively. However, a dominant state initiated by another CAN node will override a recessive state on the CAN bus. 1.4.1 HIGH-SPEED The High-Speed mode is selected by connecting the RS pin to VSS. In this mode, the transmitter output drivers have fast output rise and fall times to support highspeed CAN bus rates. 1.4.2 SLOPE-CONTROL 1.1.1 MAXIMUM NUMBER OF NODES The MCP2551 CAN outputs will drive a minimum load of 45, allowing a maximum of 112 nodes to be connected (given a minimum differential input resistance of 20 k and a nominal termination resistor value of 120). 1.2 Receiver Function Slope-Control mode further reduces EMI by limiting the rise and fall times of CANH and CANL. The slope, or slew rate (SR), is controlled by connecting an external resistor (REXT) between RS and VOL (usually ground). The slope is proportional to the current output at the RS pin. Since the current is primarily determined by the slope-control resistance value REXT, a certain slew rate is achieved by applying a respective resistance. Figure 1-1 illustrates typical slew rate values as a function of the slope-control resistance value. The RXD output pin reflects the differential bus voltage between CANH and CANL. The low and high states of the RXD output pin correspond to the Dominant and Recessive states of the CAN bus, respectively. 1.4.3 STANDBY MODE 1.3 Internal Protection CANH and CANL are protected against battery shortcircuits and electrical transients that can occur on the CAN bus. This feature prevents destruction of the transmitter output stage during such a fault condition. The device is further protected from excessive current loading by thermal shutdown circuitry that disables the output drivers when the junction temperature exceeds a nominal limit of 165C. All other parts of the chip remain operational and the chip temperature is lowered due to the decreased power dissipation in the transmitter outputs. This protection is essential to protect against bus line short-circuit induced damage. The device may be placed in standby or "SLEEP" mode by applying a high-level to RS. In SLEEP mode, the transmitter is switched off and the receiver operates at a lower current. The receive pin on the controller side (RXD) is still functional but will operate at a slower rate. The attached microcontroller can monitor RXD for CAN bus activity and place the transceiver into normal operation via the RS pin (at higher bus rates the first CAN message may be lost). 2002 Microchip Technology Inc. Preliminary DS21667C-page 3 MCP2551 TABLE 1-1: Mode Standby Slope-Control High-Speed MODES OF OPERATION Current at Rs Pin -IRS < 10 A 10 A < -IRS < 200 A -IRS < 610 A Resulting Voltage at RS Pin VRS > 0.75VDD 0.4VDD < VRS < 0.6VDD 0 < VRS < 0.3VDD TABLE 1-2: VDD TRANSCEIVER TRUTH TABLE VRS VRS < 0.75VDD TXD 0 1 or floating X 0 1 or floating X X CANH CANL Bus State( 1) RXD( 1) HIGH LOW Dominant 0 Not Driven Not Driven Recessive 1 VRS > 0.75VDD Not Driven Not Driven Recessive 1 VPOR < VDD < 4.5V VRS < 0.75VDD HIGH LOW Dominant 0 (See Note 3) Not Driven Not Driven Recessive 1 Not Driven Not Driven Recessive 1 VRS > 0.75VDD 0 < VDD < VPOR X Not Driven/ Not Driven/ High Impedance X No Load No Load Note 1: If another bus node is transmitting a dominant bit on the CAN bus, then RXD is a logic 0. 2: X = "don't care". 3: Device drivers will function, although outputs are not guaranteed to meet the ISO-11898 specification. 4.5V VDD 5.5V FIGURE 1-1: SLEW RATE VS. SLOPE-CONTROL RESISTANCE VALUE 25 20 Slew Rate V/uS 15 10 5 0 10 20 30 40 49 60 70 76 90 100 110 120 Resistance (k) DS21667C-page 4 Preliminary 2002 Microchip Technology Inc. MCP2551 1.5 TXD Permanent Dominant Detection 1.7.2 GROUND SUPPLY (VSS) Ground supply pin. If the MCP2551 detects an extended low state on the TXD input, it will disable the CANH and CANL output drivers in order to prevent the corruption of data on the CAN bus. The drivers are disabled if TXD is low for more than 1.25 ms (minimum). This implies a maximum bit time of 62.5 s (16 kb/s bus rate) allowing up to 20 consecutive transmitted dominant bits during a multiple bit error and error frame scenario. The drivers remain disabled as long as TXD remains low. A rising edge on TXD will reset the timer logic and enable the CANH and CANL output drivers. 1.7.3 SUPPLY VOLTAGE (VDD) Positive supply voltage pin. 1.7.4 RECEIVER DATA OUTPUT (RXD) RXD is a CMOS-compatible output that drives high or low depending upon the differential signals on the CANH and CANL pins and is usually connected to the receiver data input of the CAN controller device. RXD is high when the CAN bus is recessive and low in the dominant state. 1.6 Power-on Reset 1.7.5 REFERENCE VOLTAGE (VREF) When the device is powered on, CANH and CANL remain in a high-impedance state until VDD reaches the voltage level VPORH. In addition, CANH and CANL will remain in a high-impedance state if TXD is low when VDD reaches VPORH. CANH and CANL will become active only after TXD is asserted high. Once powered on, CANH and CANL will enter a high-impedance state if the voltage level at VDD falls below VPORL, providing voltage brown-out protection during normal operation. Reference Voltage Output (Defined as VDD/2). 1.7.6 CAN LOW (CANL) The CANL output drives the low side of the CAN differential bus. This pin is also tied internally to the receive input comparator. 1.7.7 CAN HIGH (CANH) 1.7 Pin Descriptions The 8-pin pinout is listed in Table 1-3. The CANH output drives the high side of the CAN differential bus. This pin is also tied internally to the receive input comparator. TABLE 1-3: Pin Number 1 2 3 4 5 6 7 8 MCP2551 PINOUT Pin Name TXD VSS VDD RXD VREF CANL CANH RS Ground Supply Voltage Receive Data Output Reference Output Voltage CAN Low-Level Voltage I/O CAN High-Level Voltage I/O Slope-Control Input Pin Function Transmit Data Input 1.7.8 SLOPE RESISTOR INPUT (RS) The RS pin is used to select High-Speed, Slope-Control or Standby modes via an external biasing resistor. 1.7.1 TRANSMITTER DATA INPUT (TXD) TXD is a TTL compatible input pin. The data on this pin is driven out on the CANH and CANL differential output pins. It is usually connected to the transmitter data output of the CAN controller device. When TXD is low, CANH and CANL are in the dominant state. When TXD is high, CANH and CANL are in the recessive state, provided that another CAN node is not driving the CAN bus with a dominant state. TXD has an internal pull-up resistor (nominal 25 k to VDD). 2002 Microchip Technology Inc. Preliminary DS21667C-page 5 MCP2551 2.0 2.1 ELECTRICAL CHARACTERISTICS Terms and Definitions 2.1.5 DIFFERENTIAL VOLTAGE, VDIFF (OF CAN BUS) Differential voltage of the two-wire CAN bus, value VDIFF = VCANH - VCANL. A number of terms are defined in ISO-11898 that are used to describe the electrical characteristics of a CAN transceiver device. These terms and definitions are summarized in this section. 2.1.6 INTERNAL CAPACITANCE, CIN (OF A CAN NODE) 2.1.1 BUS VOLTAGE Capacitance seen between CANL (or CANH) and ground during the recessive state when the CAN node is disconnected from the bus (see Figure 2-1). VCANL and VCANH, denoting the voltages of the bus line wires, CANL and CANH, relative to ground of each individual CAN node. 2.1.7 INTERNAL RESISTANCE, RIN (OF A CAN NODE) 2.1.2 COMMON MODE BUS VOLTAGE RANGE Resistance seen between CANL (or CANH) and ground during the recessive state when the CAN node is disconnected from the bus (see Figure 2-1). Boundary voltage levels of VCANL and VCANH with respect to ground, for which proper operation will occur, if up to the maximum number of CAN nodes are connected to the bus. FIGURE 2-1: PHYSICAL LAYER DEFINITIONS ECU 2.1.3 DIFFERENTIAL INTERNAL CAPACITANCE, CDIFF (OF A CAN NODE) RIN CANL RIN RDIFF CIN CIN GROUND CDIFF CANH Capacitance seen between CANL and CANH during the recessive state when the CAN node is disconnected from the bus (see Figure 2-1). 2.1.4 DIFFERENTIAL INTERNAL RESISTANCE, RDIFF (OF A CAN NODE) Resistance seen between CANL and CANH during the recessive state when the CAN node is disconnected from the bus (see Figure 2-1). DS21667C-page 6 Preliminary 2002 Microchip Technology Inc. MCP2551 Absolute Maximum Ratings VDD............................................................................................................................................................................. 7.0V DC Voltage at TXD, RXD, VREF and VS.............................................................................................-0.3V to VDD + 0.3V DC Voltage at CANH, CANL (Note 1).......................................................................................................... -42V to +42V Transient Voltage on Pins 6 and 7 (Note 2)............................................................................................. -250V to +250V Storage temperature ............................................................................................................................... -55C to +150C Operating ambient temperature .............................................................................................................. -40C to +125C Virtual Junction Temperature, TVJ (Note 3) ............................................................................................ -40C to +150C Soldering temperature of leads (10 seconds) ....................................................................................................... +300C ESD protection on CANH and CANL pins (Note 4) ................................................................................................... 6 kV ESD protection on all other pins (Note 4) .................................................................................................................. 4 kV Note 1: Short-circuit applied when TXD is high and low. 2: In accordance with ISO-7637. 3: In accordance with IEC 60747-1. 4: Classification A: Human Body Model. NOTICE: Stresses above those listed under "Maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2002 Microchip Technology Inc. Preliminary DS21667C-page 7 MCP2551 2.2 DC Characteristics Electrical Characteristics: Industrial (I): TAMB = -40C to +85C VDD = 4.5V to 5.5V Extended (E): TAMB = -40C to +125C VDD = 4.5V to 5.5V Characteristic Min Max Units Conditions DC Specifications Param No. Supply: D1 D2 D3 IDD Supply Current Sym -- -- -- -- 75 10 365 465 4.3 4.0 0.8 mA mA A A V V V Dominant; VTXD = 0.8V; VDD Recessive; VTXD = +2V; RS = 47 k -40C TAMB +85C, Standby; (Note 2) -40C TAMB +125C, Standby; (Note 2) CANH, CANL outputs are active when VDD > VPORH CANH, CANL outputs are not active when VDD < VPORL Note 1 D4 D5 D6 VPORH VPORL VPORD High-level of the power-on reset comparator Low-level of the power-on reset comparator Hysteresis of power-on reset comparator 3.8 3.4 0.3 Bus Line (CANH; CANL) Transmitter: D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 IO(SC)(CANL)l VDIFF(r)(i) VO(CANH) VO(CANL) VDIFF(r)(o) VDIFF(d)(o) IO(SC)(CANH) CANH dominant output voltage CANL dominant output voltage Recessive differential output voltage Dominant differential output voltage CANH short-circuit output current CANL short circuit output current Recessive differential input voltage VCANH(r);VCANL(r) CANH, CANL Recessive bus voltage IO(CANH)(reces) IO(CANL)(reces) Recessive output current 2.0 -2 -10 2.75 0.5 -500 1.5 -- -- -- -1.0 -1.0 D18 VDIFF(d)(i) Dominant differential input voltage 0.9 1.0 D19 D20 D21 VDIFF(h)(i) RIN RIN(d) Differential input hysteresis CANH, CANL common-mode input resistance Deviation between CANH and CANL common-mode input resistance 100 5 -3 3.0 +2 +10 4.5 2.25 +50 3.0 -200 -100 (typical) 200 +0.5 +0.4 5.0 5.0 200 50 +3 V mA mA V V mV V mA mA mA V V V V mV k % VCANH = VCANL VTXD = VDD; no load. -2V < V(CAHL,CANH) < +7V, 0V Note 1: This parameter is periodically sampled and not 100% tested. 2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD. 3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby. DS21667C-page 8 Preliminary 2002 Microchip Technology Inc. MCP2551 2.2 DC Characteristics (Continued) Electrical Characteristics: Industrial (I): TAMB = -40C to +85C VDD = 4.5V to 5.5V Extended (E): TAMB = -40C to +125C VDD = 4.5V to 5.5V Characteristic Min Max Units Conditions DC Specifications (Continued) Param No. D22 D24 Sym Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven] RDIFF ILI Differential input resistance CANH, CANL input leakage current High-level input voltage Low-level input voltage High-level input current Low-level input current High-level output voltage Low-level output voltage Reference output voltage Input voltage for standby mode Slope-control mode current Slope-control mode voltage Shutdown junction temperature Shutdown temperature hysteresis 20 -- 100 150 k A VDD < VPOR; VCANH = VCANL = +5V Output recessive Output dominant VTXD = VDD VTXD = 0V IOH = 8 mA IOL = 8 mA -50 A < IVREF < 50 A Transmitter Data Input (TXD): D25 D26 D27 D28 D31 D32 D33 D34 D35 D36 D37 D38 VIH VIL IIH IIL VOH VOL VREF VSTB ISLOPE VSLOPE TJ(sd) TJ (h) 2.0 -- -1 -100 0.7 -- 0.45 VDD 0.75 VDD -10 0.4 VDD 155 20 -- +0.8 +1 -400 -- 0.8 0.55 VDD -- -200 0.6 VDD 180 30 V V A A V V V V A V o o Receiver Data Output (RXD): Voltage Reference Output (VREF): Standby/Slope-Control (RS pin): Thermal Shutdown: C C Note 1 -12V < V(CANL, CANH) < +12V (Note 3) Note 1: This parameter is periodically sampled and not 100% tested. 2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD. 3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby. FIGURE 2-2: TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS VDD TXD VREF RXD 30 pF CANL GND RS Rext CAN Transceiver CANH 60 100 pF 0.1F Note: RS may be connected to VDD or GND via a load resistor depending on desired operating mode as described in Section 1.7.8, "Slope Resistor Input". 2002 Microchip Technology Inc. Preliminary DS21667C-page 9 MCP2551 FIGURE 2-3: TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS TXD VREF RXD CANL GND RS Rext 500 pF Note: RS may be connected to VDD or GND via a load resistor depending on desired operating mode as described in Section 1.7.8 CANH CAN Transceiver 500 pF Schaffner Generator 60 The wave forms of the applied transients shall be in accordance with "ISO-7637, Part 1", test pulses 1, 2, 3a and 3b. FIGURE 2-4: HYSTERESIS OF THE RECEIVER RXD (receive data output voltage) VDIFF (r)(i) hysteresis D19 VOH VDIFF (d)(i) VOL 0.5 0.9 VDIFF (V) DS21667C-page 10 Preliminary 2002 Microchip Technology Inc. MCP2551 2.3 AC Characteristics Electrical Characteristics: Industrial (I): TAMB = -40C to +85CVDD = 4.5V to 5.5V Extended (E): TAMB = -40C to +125CVDD = 4.5V to 5.5V Characteristic Bit time Bit frequency Delay TXD to bus active Delay TXD to bus inactive Min 1 16 -- -- -- 5 TtxL2rx(d) Delay TXD to receive active -- -- 6 TtxH2rx(r) Delay TXD to receiver inactive -- -- -- -- 7 10 11 12 13 14 15 SR tWAKE CANH, CANL slew rate Wake-up time from standby (Rs pin) 5.5 -- -- -- -- 1.25 -- Max 62.5 1000 70 125 170 130 250 175 225 235 400 8.5 5 550 20 (typical) 10 (typical) 4 1 Units s kHz ns ns ns ns ns ns ns ns ns V/s s ns pF pF ms s Rising edge on TXD while device is in permanent dominant state Conditions VRS = 0V VRS = 0V -40C TAMB +125C, VRS = 0V -40C TAMB +85C, VRS = 0V -40C TAMB +125C, VRS = 0V -40C TAMB +125C, VRS = 0V -40C TAMB +125C, RS = 47 k -40C TAMB +85C, VRS = 0V -40C TAMB +85C, RS = 47 k -40C TAMB +125C, VRS = 0V -40C TAMB +125C, RS = 47 k Refer to Figure 1-1; RS = 47 k, (Note 1) see Figure 2-6 VRS = +4V; (see Figure 2-7) 1 Mbit/s data rate; VTXD = VDD, (Note 1) 1 Mbit/s data rate (Note 1) AC Specifications Param No. 1 2 3 4 Sym tBIT fBIT TtxL2bus(d) TtxH2bus(r) TbusD2rx(s) Bus dominant to RXD Low (standby mode) CIN(CANH) CIN(CANL) CDIFF TtxL2busZ CANH; CANL input capacitance Differential input capacitance TX Permanent Dominant Timer Disable Time TtxR2pdt(res) TX Permanent Dominant Timer Reset Time Note 1: This parameter is periodically sampled and not 100% tested. 2002 Microchip Technology Inc. Preliminary DS21667C-page 11 MCP2551 2.4 Timing Diagrams and Specifications TIMING DIAGRAM FOR AC CHARACTERISTICS VDD 0V VDIFF (CANH, CANL differential voltage) RXD (receive data output voltage) 0.5V FIGURE 2-5: TXD (transmit data input voltage) 0.9V 3 5 0.3 VDD 4 6 0.7 VDD FIGURE 2-6: TIMING DIAGRAM FOR WAKEUP FROM STANDBY VDD 0.6 VDD 0V VRS Slope resistor input voltage VRXD Receive data output voltage 0.3 VDD VTXD = 0.8V 10 FIGURE 2-7: TIMING DIAGRAM FOR BUS DOMINANT TO RXD LOW (STANDBY MODE) 1.5V VDIFF, Differential voltage 0.9V 0V Receive data output voltage 0.3 VDD 11 VRS = 4V; VTXD = 2V DS21667C-page 12 Preliminary 2002 Microchip Technology Inc. MCP2551 3.0 3.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW MCP2551 I/P256 0234 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN MCP2551 I/SN0234 256 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. 2002 Microchip Technology Inc. Preliminary DS21667C-page 13 MCP2551 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c L A1 eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21667C-page 14 Preliminary 2002 Microchip Technology Inc. MCP2551 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 2002 Microchip Technology Inc. Preliminary DS21667C-page 15 MCP2551 NOTES: DS21667C-page 16 Preliminary 2002 Microchip Technology Inc. MCP2551 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) b) MCP2551-I/P: Industrial temperature, PDIP package. MCP2551-E/P: Extended temperature, PDIP package. MCP2551-I/SN: Industrial temperature, SOIC package. MCP2551T-I/SN: Tape and Reel, Industrial Temperature, SOIC package. MCP2551T-E/SN: Tape and Reel, Extended Temperature, SOIC package. Device: Temperature Range: Package: MCP2551= High-Speed CAN Transceiver I E P SN = = = = -40C to +85C -40C to +125C Plastic DIP (300 mil Body) 8-lead Plastic SOIC (150 mil Body) 8-lead c) d) e) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. Preliminary DS21667C-page 17 MCP2551 NOTES: DS21667C-page 18 Preliminary 2002 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21667C - page 19 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 EUROPE Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 15-16, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-82350361 Fax: 86-755-82366086 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 Germany Microchip Technology GmbH Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 11/15/02 DS21667C-page 20 2002 Microchip Technology Inc. |
Price & Availability of MCP2551EP
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |